Metallic additive manufacturing involves layer-by-layer production of components, typically by melting metal powders using a laser or electron beam. Additive manufacturing has many attractive features; e.g. custom-designed components can be produced with geometries not achievable by conventional methods.
However, for AM to reach its full potential, a realistic virtual representation of the complete process is required.Such a ‘digital twin’ will accelerate process design and optimisation, and form a key part of process certification and component qualification.
The development of a digital twin presents huge challenges. Not only do accurate and fast computational sub-models of the complex physical and metallurgical processes involved (powder-bed raking, heat transfer and flow in the molten pool, microstructure formation, residual stress development) have to be produced and validated, but they have to be tightly integrated. This is a critical obstacle since the sub-models use different computational approaches and treat vastly different scales, from powder (~50 micrometres) to part (up to metres).
The symposium will bring together leading experts in a diverse range of relevant fields including;
- metallic additive manufacturing,
- computational modelling,
- multiscale techniques,
- structure-property relations,
- machine learning and artificial intelligence, and
- digital twins of industrial processes.
Through keynote lectures, poster presentations and facilitated discussion sessions, we aim to -
- Define the requirements for a true digital twin of the additive manufacturing process
- Identify the main barriers to developing such software, including those involved in linking sub-models across scales
- Explore the physical, metallurgical and computational approaches to overcome these barriers; and
- Set out a roadmap for the development of a digital twin.
The symposium is directed towards researchers, managers, students and others from academia, government and industry.
We especially encourage early-career researchers to attend; the symposium will include a networking session, and we are offering travel bursaries to several early-career researchers (details to be announced).
The 'Digital Twin' symposium will follow APICAM 2019 (2nd Asia-Pacific International Conference on Additive Manufacturing), to be held in Melbourne from 31 June to 3 July.